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      Products and Services

      We offer a wide range of PCB products including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates. We also offer value-added services to support our customers' needs.

      TTM services also include Electro-Mechanical Solutions (E-MS). Our products in this area include sheet metal design and fabrication, backplane assembly, system integration, test and logistics for a complete solution supporting sub-system and full system integration requirements.

      Printed Circuit Board Fabrication

      Conventional PCB

      • Multilayer up to 60+ layers
      • Embedded passives
      • Heavy copper up to 10 oz.
      • Over 50 UL approved laminates
      • Thickness up to 0.450"
      • Thin core dielectrics
      • Dimensions up to 30" x 54"
      • Mixed dielectrics

      HDI

      • Up to 12L "anylayer" stacked uVia Structure
      • 1.6 / 2.0 mil line / space
      • Wide material and surface finish selections
      • 14 mil, 6L ultra thin structure
      • 3/7 mil uVia / Pad size
      • 0.4 mm pitch BGA with 2 traces fanout
      • Embedded, distributed and discrete passive components

      Flex & Rigid-Flex

      • Type 2, 3 and 4 (double sided, multilayer and rigid-flex)
      • 30+ layers
      • Dimensions up to 24" x 48"
      • Acrylic, epoxy and adhesive-less polyimide flex materials
      • Over 50 rigid material options
      • Thickness up 0.300"
      • Bikini cut, bookbinder and loose leaf construction
      • Combination surface finishes
      • Epoxy fillet

      RF & Microwave

      • High frequency / bandwidth designs
      • Planar and screened resistors
      • Dimensions up to 24" x 48"
      • Mixed dielectrics (hybrids)
      • Dielectric foam
      • Conductive paste
      • Plated cavities
      • Formed (conformal) PCBs
      • Optical machining

      Thermal Management

      • Passive and active designs
      • Buried metal core constructions
      • Externally mounted heatsinks
      • Epoxy and B-stage films
      • Thermal & conductive bonding
      • Aluminum & copper base materials
      • Various surface finishes
      • In-house milling and bonding

      IC Substrate

      • 2,4,6 Layers (2+2+2 stacked via)
      • BT material
      • Wire bonding (ENEPIG, Soft gold, Hard gold)
      • Type: SIP,CSP,BOC & FC package
      • Fine trace width/space 25/25um
      • Thin board: 130um(2L), 170um(4L)
      • Flip chip C4 pad

      Custom Assembly

      Backplanes

      • Dimensions up to 28" x 52"
      • Thickness up to 0.400"
      • Custom and Industry Standard
      • Press-fit (compliant a€“pin)
      • Surface mount (chip, QFP, BGA)
      • Wave / selective solder
      • AOI & X-ray inspection
      • Level 2, 3 & 4 testing
      • Conformal coating

      Flex & Rigid-Flex

      • Dimensions up to 22" x 52"
      • Passive & active components
      • Press-fit (compliant-pin)
      • Surface mount (chip, QFP, BGA)
      • AOI & X-ray inspection
      • Level 2,3, & 4 testing

      RF & Microwave

      • Dimensions up to 22" x 34"
      • Blind via, surface mount, thru-hole
      • 1-piece hermetic GPO and GPPO
      • X-ray inspection
      • RF testing (20+ GHz)

      Integrated Assembly

      • Card cage through cabinet
      • Backplanes & Midplanes
      • Harnessing & cabling
      • Power supplies & fan trays
      • Peripherals & controllers
      • I/O interfaces
      • Functional testing
      • Mil & Aero conduction cooled
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